Our Eindhoven based client is currently searching for a Senior Packaging Design Engineer. The role will involve designing new packages for state of the art ICs. Analyzing the signal quality  of the high speed interface by SI and PI simulations will be required, as well as liaising with subcon houses and package manufacturers. 

Required skills for the Senior Packaging Design Engineer will include:

• Strong semiconductor packaging knowledge
• Semiconductor device and processing knowledge
• Familiarity with Signal Integrity and Power Integrity simulations
• Bachelor, or Master Degree of Electrical and Electronic Engineering or equivalent, with 5 years+ experience in the semiconductor industry

Please contact Rachel Anderson for further details.